Power Semiconductors Integrated with Heatsinks, Liquid Cooling Devices,
Fans, Blowers, Clamps and/or Controller Boards.
The mounting of high power semiconductors requires clamp that is capable of exerting a minimum force, given by the semiconductor manufacturer. The force applied by the clamp minimizes both electrical and thermal resistance by insuring the semiconductor is in intimate contact with the heatsink and bus bars, allowing your circuit to operate as designed.
The clamps that Applied Power Systems, Inc. (APS) offers have been specially designed to meet the requirements of all semiconductor manufacturers and get maximum performance from the devices. APS also has a complete line of air-cooled and liquid-cooled heatsinks available off-the-shelf. In addition, APS offers complete line of standard assemblies in many circuit configurations for quick delivery.
Advantages of APS clamps:
* Accurate and rugged force gauge to properly load press pack semiconductors.
* Center loaded force application.
* Complete range of force levels from 1000 pounds to over 20,000 pounds to allow for semiconductors of 100 mm or greater in diameter.
* A full line of standard air and liquid cooled heatsinks.
* Design facilities available for special requirements.
The most efficient way to remove heat from a large area semiconductor (>23mm silicon diameter) is to package it into a flat circular package that allows heat and current to be removed or passed from both the anode and cathode of the device with as little thermal and electrical resistance as possible. This type of package is called by many names, hockey puck, press pack, flat pack and disc. From a user’s point of view, it is the most difficult package to use since it not only requires two heat sinks (anode and cathode) but also requires a clamp that holds the assembly together and applies sufficient force to minimize the thermal and electrical resistance. The clamping force makes the electrical and thermal connections to the device. In addition, the method used to tighten and accurately gauge the applied force is not immediately apparent or trivial. Over tightening, under tightening and/or not maintaining a parallel force on the pole face of the device often leads to premature failure. Our series of clamps available minimizes or eliminate many of these problems.
The clamping force applied to the semiconductor pole faces is critical and must be in accordance with the specified force from the semiconductor manufacturer. It is also necessary that the force be applied evenly across the entire surface of both pole faces and normal to the pole face plane of the devices being assembled. The clamp must apply the force evenly across the pole faces and not cause mechanical stress to be transferred to the semiconductor element over the entire temperature range to which the assembly will be exposed. Stress caused by non-perpendicular application of the clamp can cause a number of problems including cracking the semiconductor element, current crowding causing the semiconductor to have excessive hot spots, poor thermal conduction causing overheating of the semiconductor element, etc. When installed properly, disc clamps will provide good electrical contact and a low thermal resistance to insure proper heat removal.
Below are many examples of Semicondutcor Assemblies we have designed and manufactured using bith standard and custom heatsinks and clamps.
Our High-Power Semiconductor Assemblies are available with Single, Doubler, Three Phase, Full Bridge, Series Stacks, Parallel, AC Switch, Static Switch, Common Anode/Common Cathode Topologies. Options for include Air or Liquid Cooled, Bus Bars, Gate Firing Boards, Fuses, Snubbers, Blowers/Fans, Thermal Switches, Insulated Mounting and FiberOptic Interfaces. We offer a wide range of Power Semiconductors to satisfy a wide range of power management requirements.
(click on image for an expanded view)